Tech Talk

What is CAMM2 memory?

CAMM2 DDR5 module


Last updated 29 November 2024

In 2022, Dell introduced a new memory module form factor concept to JEDEC in the form of CAMM2 – which stands for Compression Attached Memory Module (and 2). The concept and design were for use in laptops and compact computing devices, with the goal overcoming technical limitations perceived with traditional slotted DIMMs, as technologies, demands, and speeds advance.

Since 2022, laptops with CAMM memory have come to market and progressed via a new CAMM2 standard via DDR5 CAMM2 or LPDDR5 CAMM2. Very much a new way of things, with most of today's PCs and systems using DIMMs (Dual Inline Memory Modules). So, what are the differences between the two?

CAMM2 vs DIMMs

Let's take a little look below into some differences as it stands with the technologies.

FeatureDIMMsCAMM2
Form FactorRectangular PCBLand-grid array, flat “slab-like"
CapacityUp to 512GB of RAMUp to 128GB of RAM
Target DevicesServers, Desktops, Laptops, SystemsThin-Laptops, Compact Systems
MountingVertical SlotsParallel to motherboard
Pin CountDDR4 SO-DIMM x260, DDR5 SO-DIMM x288DDR5/LPDDR5 CAMM2 x644
Space EfficiencyModerateHigh
Thermal ManagementStandardImproved due to flat design
AdoptionIndustry standardEmerging standard

 

Example: Micron LPCAMM2

 

Potential advantages of CAMM2

As explained, the evolution of CAMM has to address limitations of the market dominant SO-DIMMs, with the ultimate goal of prioritising compactness, efficiency, and performance. 

Space Efficiency: The design of CAMM2 compared to DIMMs is that for a flatter design. With laptops and industrial applications, space is of the premium. So with CAMM2, the design can reduce height footprint making it a better emerging option within thinner devices and systems.

Performance: The potential for greater performance compared to DIMMs comes with the higher bandwidth. This is all possible. With the pin count at 644 compared to 288 with DDR5 SO-DIMM - this improves electrical signalling efficiency.

Thermal: The flat design of CAMM2 and parallel layout can mean better thermal management and ultimately, heat dissipation. Such a design can benefit contact with cooling solutions, such as heat sinks or thermal pads. What's more, the height can eliminate hotspots often associated with tight configurations.

Which is right for you?

DIMMs are still continuing to move and develop with new DDR generations. They're key for building and upgrading desktops where space is not a primary concern. For servers and workstations within the data centre, they are and will still be dominant alongside the growing CXL and HBM technologies here, with broad compatibility and scalability which make them the absolute choice for high performance applications and growing AI demand.

CAMM2 has real limitations right now with not too much of the market, and nowhere near standardised like DIMMs or widely available. However, if you're working with laptops or space-constrained industrial systems/devices, the compact design and enhanced thermal benefits make it ideal for the next generation of thin-systems. CAMM2 could meet the demands of AI within these areas, with dual-channel design and twice the bandwidth of standard SO-DIMM.

The technology is set to be an exciting evolution in the timeline of memory. Simms will look to update this article as the technology develops to give you information on CAMM2 technology.

Author

Drew

Drew is Marketing Lead at Simms, leading our marketing department. Drew has a strong knowledge datacentre and server proposition, and leads on our industrial and embedded side of the business also.